{"id": "njw-55bbcf", "key": "brainet-55bbcf", "title": "中国最大芯片封装厂，用自研 2.5D 平台追赶台积电 CoWoS", "author": "脑机网编辑部", "publisher": "脑机网", "date": "2026-11-09", "url": "https://www.logic.wang/a/njw-55bbcf", "section": "算力芯片", "gbt7714": "脑机网编辑部. 中国最大芯片封装厂，用自研 2.5D 平台追赶台积电 CoWoS[EB/OL]. (脑机网)[2026-11-09]. 北京: 脑机网, https://www.logic.wang/a/njw-55bbcf. 2026-11-09.", "apa": "脑机网编辑部. (2026, November 9). 中国最大芯片封装厂，用自研 2.5D 平台追赶台积电 CoWoS. 脑机网. https://www.logic.wang/a/njw-55bbcf", "mla": "\"中国最大芯片封装厂，用自研 2.5D 平台追赶台积电 CoWoS.\" 脑机网编辑部, 脑机网, 9 November 2026, www.logic.wang/a/njw-55bbcf.", "chicago": "\"中国最大芯片封装厂，用自研 2.5D 平台追赶台积电 CoWoS.\" 脑机网编辑部, 脑机网. November 9, 2026.", "bibtex": "@misc{brainet-55bbcf,\n  author       = {{脑机网编辑部}},\n  title        = {{中国最大芯片封装厂，用自研 2.5D 平台追赶台积电 CoWoS}},\n  year         = {2026},\n  month        = {November},\n  publisher    = {{脑机网}},\n  howpublished = {\\url{https://www.logic.wang/a/njw-55bbcf}},\n  note         = {Accessed 2026-11-09},\n  language     = {chinese}\n}\n", "ris": "TY  - GEN\nTI  - 中国最大芯片封装厂，用自研 2.5D 平台追赶台积电 CoWoS\nAU  - 脑机网编辑部\nPY  - 2026\nDA  - 2026/11/09\nPB  - 脑机网\nUR  - https://www.logic.wang/a/njw-55bbcf\nLA  - zh\nER  - \n", "exports": {"bibtex": "https://www.logic.wang/a/njw-55bbcf.bib", "ris": "https://www.logic.wang/a/njw-55bbcf.ris", "markdown": "https://www.logic.wang/a/njw-55bbcf.md", "json": "/api/cite/njw-55bbcf"}}